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Micron Technology
Micron Technology

MT47H64M8 Datasheet Preview

MT47H64M8 Datasheet

DDR2 SDRAM

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MT47H64M8 pdf
512Mb: x4, x8, x16 DDR2 SDRAM
Features
DDR2 SDRAM
MT47H128M4 – 32 Meg x 4 x 4 banks
MT47H64M8 – 16 Meg x 8 x 4 banks
MT47H32M16 – 8 Meg x 16 x 4 banks
Features
• VDD = 1.8V ±0.1V, VDDQ = 1.8V ±0.1V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Duplicate output strobe (RDQS) option for x8
• DLL to align DQ and DQS transitions with CK
• 4 internal banks for concurrent operation
• Programmable CAS latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1 tCK
• Selectable burst lengths: 4 or 8
• Adjustable data-output drive strength
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
• Industrial temperature (IT) option
• RoHS-compliant
• Supports JEDEC clock jitter specification
Options1
• Configuration
– 128 Meg x 4 (32 Meg x 4 x 4 banks)
– 64 Meg x 8 (16 Meg x 8 x 4 banks)
– 32 Meg x 16 (8 Meg x 16 x 4 banks)
• FBGA package (Pb-free) – x16
– 84-ball FBGA (8mm x 12.5mm) Rev. G
– 84-ball FBGA (8mm x 12.5mm) Rev. H
• FBGA package (Pb-free) – x4, x8
– 60-ball FBGA (8mm x 10mm) Rev. G
– 60-ball FBGA (8mm x 10mm) Rev. H
• FBGA package (lead solder) – x16
– 84-ball FBGA (8mm x 12.5mm) Rev. G
• FBGA package (lead solder) – x4, x8
– 60-ball FBGA (8mm x 10mm) Rev. G
• Timing – cycle time
– 1.875ns @ CL = 7 (DDR2-1066)
– 2.5ns @ CL = 5 (DDR2-800)
– 3.0ns @ CL = 5 (DDR2-667)
• Self refresh
– Standard
– Low-power
• Operating temperature
– Commercial (0°C TC +85°C)2
– Industrial (–40°C TC +95°C;
–40°C TA +85°C)
• Revision
Marking
128M4
64M8
32M16
HR
NF
CF
SH
HW
JN
-187E
-25E
-3
None
L
None
IT
:G/:H
Notes:
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on www.micron.com for
product offerings and availability.
2. For extended CT operating temperature,
see Table 11 (page 29), Note 7.
Table 1: Key Timing Parameters
Speed Grade
-187E
-25E
-3
CL = 3
400
400
400
CL = 4
533
533
533
Data Rate (MT/s)
CL = 5
800
800
667
CL = 6
800
800
n/a
CL = 7
1066
n/a
n/a
tRC (ns)
54
55
55
PDF: 09005aef85651470
512MbDDR2.pdf - Rev. Y 06/17 EN
1 Micron Technology, Inc. reserves the right to change products or specifications without notice.
‹ 2004 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.



Micron Technology
Micron Technology

MT47H64M8 Datasheet Preview

MT47H64M8 Datasheet

DDR2 SDRAM

No Preview Available !

MT47H64M8 pdf
512Mb: x4, x8, x16 DDR2 SDRAM
Features
Table 2: Addressing
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
128 Meg x 4
32 Meg x 4 x 4 banks
8K
A[13:0] (16K)
BA[1:0] (4)
A[11, 9:0] (2K)
64 Meg x 8
16 Meg x 8 x 4 banks
8K
A[13:0] (16K)
BA[1:0] (4)
A[9:0] (1K)
32 Meg x 16
8 Meg x 16 x 4 banks
8K
A[12:0] (8K)
BA[1:0] (4)
A[9:0] (1K)
Figure 1: 512Mb DDR2 Part Numbers
Example Part Number:
MT47H128M4SH-25E:H
-
MT47H
Configuration Package
Speed
:
Revision
Configuration
128 Meg x 4
64 Meg x 8
32 Meg x 16
128M4
64M8
32M16
:G/:H Revision
L Low power
IT Industrial temperature
Package
Pb-free
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10.0mm FBGA
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10.0mm FBGA
Lead solder
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10mm FBGA
HR
CF
NF
SH
HW
JN
-3
-25E
-187E
Speed Grade
tCK = 3ns, CL = 5
tCK = 2.5ns, CL = 5
tCK = 1.875ns, CL = 7
Note: 1. Not all speeds and configurations are available in all packages.
FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
PDF: 09005aef85651470
512MbDDR2.pdf - Rev. Y 06/17 EN
2 Micron Technology, Inc. reserves the right to change products or specifications without notice.
‹ 2004 Micron Technology, Inc. All rights reserved.


Part Number MT47H64M8
Description DDR2 SDRAM
Maker Micron Technology
Total Page 30 Pages
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