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LX3052

Manufacturer: Microsemi (now Microchip Technology)

LX3052 datasheet by Microsemi (now Microchip Technology).

This datasheet includes multiple variants, all published together in a single manufacturer document.

LX3052 datasheet preview

LX3052 Datasheet Details

Part number LX3052
Datasheet LX3052 LX3051 Datasheet (PDF)
File Size 184.70 KB
Manufacturer Microsemi (now Microchip Technology)
Description InGaAs PIN PHOTODIODE
LX3052 page 2 LX3052 page 3

LX3052 Overview

Microsemi’s InGaAs Coplanar PIN Photodiode chips are ideal for high bandwidth 1310 and 1550 nm single-mode-fiber optical networking applications. The device family offers superior responsivity performance and high bandwidth with large active area in single die and 1x4 array die. The G-S-G coplanar waveguide allows very low cross-talk within the array.

LX3052 Key Features

  • LX3051 single die, 3 Gbs, 80µm active area
  • LX3050 single die, 10 Gbs, 32µm active area
  • LX3052 1x4 array die, 10 Gbs, 32µm active area
  • Coplanar Waveguide, 50 ohm characteristic impedance
  • High Responsivity
  • Low Dark Current
  • High Bandwidth
  • Anode/Cathode on illuminated Side
  • 125µm Pad pitch
  • Die good for bond wire or flip chip
Microsemi (now Microchip Technology) logo - Manufacturer

More Datasheets from Microsemi (now Microchip Technology)

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