* Chip Outline Dimensions: 41 x 41 mils Chip Thickness: 8 to 12 mils Anode Metallization: Aluminum Metallization Thickness: 50,000Ã Nominal Bonding Area: 23 x 23 mils Min. Back Metallization: Gold Junction Passivated wit
JANKCE1N5804 Datasheet (46.75 KB)
JANKCE1N5804
Microsemi ↗ Corporation
46.75 KB
6 amps fast recovery rectifier.
7516 Central Industrial Drive Riviera Beach, Florida 33404 PHONE: (561) 842-0305 FAX: (561) 845-7813 1N5802 1N5804 1N5806 JANHCE and JANKCE JANHCF an.
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