Ceramics Hard Glass Silicone Adhesive Au-plated Au-plated 0.26g(TYP) K A Die Heat Sink Protection Device 3 SOLDERING
* Recommended Reflow Soldering Condition(Lead-free Solder) 1 to 5°C per sec Pre-heat 180 to 200°C 60sec Max Above 2.

NVS2310

NVS4001N

NVS4001NT1G

NVS4409N

NVSA219BT

NVSL119CT

NVSL219BT-V1

NVSL219CT

NVSLE21AT

NVSW119BT-V1

NVSW119CT

NVSW219BT-V1

NVSW219CT