LQFP64
LQFP64 is low profile quad flat package manufactured by NXP Semiconductors.
SOT1699-1
LQFP64, plastic, low profile quad flat package; 64 terminals;
0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body
22 November 2019
Package information
1 Package summary
Terminal position code Package type descriptive code Package style descriptive code Package body material type JEDEC package outline code Mounting method type Issue date Manufacturer package code
Q (quad) LQFP64 LQFP (low profile quad flat package) P (plastic) MS-026 BCD S (surface mount) 25-01-2016 98ASS23234W
Table 1. Package summary Parameter package length package width package height nominal pitch actual quantity of termination
Min
Nom
Max
Unit
10.2 mm
10.2 mm
1.45 mm
- 0.5
- mm
- 64
- NXP Semiconductors
SOT1699-1
LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body
2 Package outline
Figure 1. Package outline LQFP64 (SOT1699-1)
SOT1699-1
Package information
All information provided in this document is subject to legal disclaimers.
22 November 2019
© NXP B.V. 2019. All rights reserved.
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NXP Semiconductors
SOT1699-1
LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body
Figure 2. Package outline detail of LQFP64...
