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MMBT3416LT3 General Purpose Amplifier(NPN Silicon)

MMBT3416LT3 Description

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MMBT3416LT3/D General Purpose Amplifier NPN Silicon COLLECTOR 3 1 BASE MMBT3416LT3 3 .

MMBT3416LT3 Features

* a solder reflow process. 0.037 0.95 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 inches mm SOT
* 23 SOT
* 23 POWER DISSIPATION The power dissipation of the SOT
* 23 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for m

MMBT3416LT3 Applications

* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a

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Datasheet Details

Part number
MMBT3416LT3
Manufacturer
ON
File Size
297.04 KB
Datasheet
MMBT3416LT3_ONSemiconductor.pdf
Description
General Purpose Amplifier(NPN Silicon)

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General Purpose AmplifierNPN Silicon ON
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