NXH50C120L2C2ES1G Key Features
- Low Thermal Resistance Substrate for Low Thermal Resistance
- Lower Package Height than Standard Case Modules
- 6 mm Clearance distance between pin to heatsink
- pact 73 mm × 40 mm × 8 mm Package
- Solderable Pins
- Thermistor
- These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS