Description
Assembly Die Process and Design ANALYSIS RESULTS I Assembly ANALYSIS RESULTS II Die Process and Design ANALYSIS PROCEDURE
PAGE
1 1
2 2-3
4
5-7 8
TABLES Overall Evaluation Package Markings Wirebond Strength Die and Package Materials Horizontal Dimensions Vertical Dimensions
9 10 10 11 12 13
-i
Features
- Three metal, twin-well CMOS process.
- Sub-micron gate lengths (0.5 micron). 1These items present possible quality or reliability concerns. They should be discussed with the manufacturer to determine their possible impact on the intended.
ISP1040B Datasheet
