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M6MGD13TW34DWG Datasheet - Renesas Technology

CMOS FLASH MEMORY

M6MGD13TW34DWG Features

* Access Time Flash Mobile RAM Supply Voltage Ambient Temperature Package 70ns (Max.) 80ns (Max.) FM-VCC=2.7 ~ 3.0V Ta= -40 ~ 85 degree 72pin S-CSP, Ball pitch 0.80mm Outer-ball:Sn-Ag-Cu Application Mobile communication products PIN CONFIGURATION (TOP VIEW) INDEX(Laser Marking) 1 DU DU NC A5 A4 A0

M6MGD13TW34DWG General Description

The M6MGD13TW34DWG is a Stacked Chip Scale Package The M6MGD13TW34DWG is suitable for a high performance cellular phone and a mobile PC that are required to be small (S-CSP) that contents 128M-bit Flash memory and 32M-bit mounting area, weight and small power dissipation. Mobile RAM in a 72-pin Stac.

M6MGD13TW34DWG Datasheet (151.58 KB)

Preview of M6MGD13TW34DWG PDF

Datasheet Details

Part number:

M6MGD13TW34DWG

Manufacturer:

Renesas ↗ Technology

File Size:

151.58 KB

Description:

Cmos flash memory.
www.DataSheet4U.com RENESAS LSIs M6MGD13TW34DWG 134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-.

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M6MGD13TW34DWG CMOS FLASH MEMORY Renesas Technology

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