1gb e-die nand flash.
. 4 1.3 General Description..... 4 1.4Pin Configuration (TSOP1) ..... 5 1.4.1 Package Dimensions ...... 5 1.5 Pin Configuration (FBGA) ...... 6 1.5.1 Package Dimensions ..
where product failure could result in loss of life or personal or physical harm, or any military or defense application,.
.... 4 1.2 Features . 4 1.3 General Description..... 4 1.4Pin Configuration (TSOP1) ..... 5 1.4.1 Package Dimensions ...... 5 1.5 Pin Configuration (FBGA) ...... 6 1.5.1 Package Dimensions ...... 7 1.6 Pin Description .. 8 2.0 PRODUCT INTRODUCTION....
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