2C3501 npn equivalent, chip type 2c3501 geometry 5620 polarity npn.
Mechanical Specifications
Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 22.5 kÅ min. Au - 6.5 kÅ nom. 5.0 mils diame.
Designed for switching and amplifier applications. Features:
Mechanical Specifications
Metallization Bonding Pad Size .
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