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Geometry

Geometry DataSheet

InterFET

P0099F - Process Geometry

 · 11 Hits • Low Noise: 2.0 nV/√Hz Typical • Typical Input Capacitance: 18pF • Typical Breakdown Voltage: 60V • High Input Impedance • Small Die: 492um X 492um X...
InterFET

N0072S - Process Geometry

 · 11 Hits • Low Noise: 2.0 nV/√Hz Typical • Typical Input Capacitance: 6.5pF • Typical Breakdown Voltage: -45V • Small Die: 467um X 467um X 203um • Bond Pads: 9...
InterFET

N0042Y - Process Geometry

 · 11 Hits • Typical Input Capacitance: 6pF • High Breakdown Voltage: -400V Typical • Small Die: 746um X 746um X 203um • Bond Pads: 95um Diameter • Substrate Con...
InterFET

N0016H - Process Geometry

 · 9 Hits • Low Input Capacitance: 3.5pF Typical • Low Gate Leakage: 10pA Typical • High Breakdown Voltage: -60V Typical • High Input Impedance • Small Die: 391...
InterFET

N0030L - Process Geometry

 · 9 Hits • Low Input Capacitance: 5.0pF Typical • Low Gate Leakage: 10pA Typical • High Breakdown Voltage: -30V Typical • High Input Impedance • Small Die: 365...
InterFET

N0032H - Process Geometry

 · 9 Hits • Low Input Capacitance: 6.0pF Typical • Low Gate Leakage: 10pA Typical • High Breakdown Voltage: -60V Typical • Small Die: 416um X 416um X 203um • Bo...
Semicoa

2C5664 - Chip Type 2C5664 Geometry 9221 Polarity NPN

 · 8 Hits • High voltage ratings Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 3...
InterFET

N0450S - Process Geometry

 · 8 Hits • Low Noise: 1.0 nV/√Hz Typical • Typical Input Capacitance: 28pF • Typical Breakdown Voltage: -45V • High Input Impedance • Small Die: 670um X 670um ...
InterFET

N0132H - Process Geometry

 · 8 Hits • Low Noise: 1.5 nV/√Hz Typical • Typical Input Capacitance: 12pF • Typical Breakdown Voltage: -60V • High Input Impedance • Small Die: 518um X 518um ...
InterFET

N0014EU - Process Geometry

 · 8 Hits • Low Input Capacitance: 2.3pF Typical • Low Gate Leakage: 1.5pA Typical • High Breakdown Voltage: -30V Typical • High Input Impedance • Die Size: 482...
InterFET

N0072L - Process Geometry

 · 8 Hits • Low Noise: 2.0 nV/√Hz Typical • Typical Input Capacitance: 7.0pF • Typical Breakdown Voltage: -30V • Small Die: 467um X 467um X 203um • Bond Pads: 9...
InterFET

N0001H - Process Geometry

 · 8 Hits • Low Input Capacitance: 2.0pF Typical • Low Gate Leakage: 0.5pA Typical • High Breakdown Voltage: -60V Typical • High Input Impedance • Small Die: 36...
InterFET

N0450L - Process Geometry

 · 7 Hits • Low Noise: 0.9 nV/√Hz Typical • Typical Input Capacitance: 35pF • Typical Breakdown Voltage: -30V • High Input Impedance • Small Die: 670um X 670um ...
InterFET

N0026S - Process Geometry

 · 7 Hits • Low Input Capacitance: 4.3pF Typical • Low Gate Leakage: 10pA Typical • High Breakdown Voltage: -45V Typical • High Input Impedance • Small Die: 365...
InterFET

N0014L - Process Geometry

 · 7 Hits • Low Input Capacitance: 2.3pF Typical • Low Gate Leakage: 2.0pA Typical • High Breakdown Voltage: -30V Typical • High Input Impedance • Small Die: 36...
Semicoa

2C2907A - Chip Type 2C2907A Geometry 0600 Polarity PNP

 · 6 Hits SQ2907AF, 2N3486, 2N3486A, 2N6987, 2N6989 Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside ...
InterFET

N0132S - Process Geometry

 · 6 Hits • Low Noise: 1.2 nV/√Hz Typical • Typical Input Capacitance: 13pF • Typical Breakdown Voltage: -45V • High Input Impedance • Small Die: 518um X 518um ...
Semicoa Semiconductor

SQ918 - Chip Type 2C918 Geometry 0013 Polarity NPN

 · 5 Hits • High frequency rating Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - ...
Semicoa

2C3866A - Chip Type 2C3866A Geometry 1007 Polarity NPN

 · 5 Hits Special Characteristics: ft = 950 MHz (type) at 50 mA/15V Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surfa...
Semicoa

2C3960 - Chip Type 2C3960 Geometry 0003 Polarity NPN

 · 5 Hits 2N3960, 2N3960UB, SD3960F, SQ3960, SQ3960F Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backsid...
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