* Medium power ratings Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 37.5 kÅ min. Au -.

Designed for medium power amplifier and switching and wide band amplifier applications. Features:
* Medium power ra.

2C5109

2C5153

2C5154

2C5551

2C5574

2C5583

2C5664

2C133A

2C139A

2C147A

2C156A

2C162A

2C162B

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