IIM-42652
IIM-42652 is High-performance 6-Axis SmartIndustrial MotionTracking MEMS manufactured by TDK Corporation.
IIM-42652 Datasheet
High-performance 6-Axis Smart Industrial™ Motion Tracking MEMS Device for Industrial Applications
GENERAL DESCRIPTION
The IIM-42652 is a 6-axis Smart Industrial™ Motion Tracking device that supports an extended operating temperature range.
The IIM-42652 bines a 3-axis gyroscope, and a 3-axis accelerometer in a small 2.5 mm x 3 mm x 0.91 mm (14-pin LGA) package. It also Features a 2 KB FIFO that can lower the traffic on the serial bus interface and reduce power consumption by allowing the system processor to burst read sensor data and then go into a low-power mode.
IIM-42652 supports highly accurate external clock input to reduce system level sensitivity error, improve orientation measurement from gyroscope data and to reduce ODR sensitivity to temperature and device to device variation.
The host interface can be configured to support I3CSM slave, I2C slave, or SPI slave modes. The I3CSM interface supports speeds up to 12.5 MHz (data rates up to 12.5 Mbps in SDR mode, 25 Mbps in DDR mode), the I2C interface supports speeds up to 1 MHz, and the SPI interface supports speeds up to 24 MHz.
The device Features an operating voltage range from 3.6V down to 1.71V.
ORDERING INFORMATION
PART NUMBER TEMPERATURE PACKAGE
IIM-42652†
- 40°C to +105°C 14-pin LGA
†Denotes Ro HS and Green-pliant package
APPLICATIONS
- Navigation
- Orientation measurement
- Tilt sensing
- Platform stabilization
- Robotics
Features
- Digital-output X-, Y-, and Z-axis angular rate sensors (gyroscopes) with programmable full-scale range of ±15.625, ±31.25, ±62.5, ±125, ±250, ±500, ±1000, and ±2000 degrees/sec
- Digital-output X-, Y-, and Z-axis accelerometer with programmable fullscale range of ±2g, ±4g, ±8g and ±16g
- User-programmable interrupts
- I3CSM / I2C / SPI slave host interface
- Digital-output temperature sensor
- Small and thin package:
2.5 mm x 3 mm x 0.91 mm (14-pin LGA)
- 20,000 g shock tolerant
- MEMS structure hermetically sealed and bonded at wafer...