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TC358775XBG Datasheet Mobile Peripheral

Manufacturer: Toshiba

Overview: TC358774XBG/TC358775XBG CMOS Digital Integrated Circuit Silicon Monolithic TC358774XBG/TC358775XBG Mobile Peripheral Devices Overview TC358774XBG The TC358774XBG/TC358775XBG Functional Specification defines operation of the DSISM to LVDS low power chip (or more abbreviated, TC358775XBG chip). TC358775XBG is the follow-up chip of TC358764XBG/ TC358765XBG, which: 1. Is pin compatible to TC358764XBG/TC358765XBG P-VFBGA49-0505-0.65-001 Weight: 39 mg (Typ.) 2. Exhibit LVDS Tx block operates at 1.8V @135 MHz to reduce operation power TC358775XBG 3. Update 4-lane DSI Rx max bit rate @ 1 Gbps/lane to support 1920×1200×24 @60fps 4. Add STBY pin with to enable turning on VDDIO power first before other power supplies. The primary function of this chip is DSI-to-LVDS Bridge, enabling P-VFBGA64-0606-0.65-001 Weight: 55 mg (Typ.) video streaming output over DSI link to drive LVDS-compatible display panels. The chip supports up to 1600×1200 24-bits per pixel resolution for single-link LVDS and up to WUXGA (1920×1200 24-bits pixels) resolution for dual-link LVDS. As a secondary function, the chip also supports an I2C Master which is controlled by the DSI link; this may be used as an interface to any other control functions through I2C.

Download the TC358775XBG datasheet PDF. This datasheet also includes the TC358774XBG variant, as both parts are published together in a single manufacturer document.

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Key Features

  • a Magic Square algorithm which enables a RGB666 display panel to produce a display quality almost equivalent to that of an RGB888 24-bits panel.
  • Flexible mapping of parallel data input bit ordering.
  • Supports programmable clock polarity.
  • Supports two power saving states - Sleep state, when receiving DSI ULPS signaling - Standby state, entered by STBY pin assertion.
  • System Operation.
  • Host configures the chip through DSI link.
  • Through DSI link, Host accesses the chip r.

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