Datasheet Details
| Part number | MA4BPS201 |
|---|---|
| Manufacturer | Tyco Electronics (now TE Connectivity) |
| File Size | 83.95 KB |
| Description | PIN Diode Chips with Offset Bond Pads |
| Download | MA4BPS201 Download (PDF) |
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| Part number | MA4BPS201 |
|---|---|
| Manufacturer | Tyco Electronics (now TE Connectivity) |
| File Size | 83.95 KB |
| Description | PIN Diode Chips with Offset Bond Pads |
| Download | MA4BPS201 Download (PDF) |
|
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These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process.
They contain a single shunt silicon PIN diode embedded in a glass substrate with dual 75 x 150 micron bond pads located near the chip edges.
The large pads allow use of multiple bond wires.
PIN Diode Chips With Offset Bond Pads MA4BPS101, MA4BPS201, MA4BPS301 MA4BPS101, MA4BPS201, MA4BPS301 PIN Diode Chips with Offset Bond.
| Part Number | Description |
|---|---|
| MA4BPS101 | PIN Diode Chips with Offset Bond Pads |
| MA4BPS301 | PIN Diode Chips with Offset Bond Pads |
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| MA40032 | Stripline Packaged Schottky Mixer Diodes |
| MA40033 | Stripline Packaged Schottky Mixer Diodes |
| MA40036 | Stripline Packaged Schottky Mixer Diodes |
| MA40045 | Stripline Packaged Schottky Mixer Diodes |
| MA40048 | Stripline Packaged Schottky Mixer Diodes |
| MA40053 | Schottky Detector Diodes |
| MA40060 | Stripline Packaged Schottky Mixer Diodes |