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MA4BPS201 - PIN Diode Chips with Offset Bond Pads

Description

These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process.

They contain a single shunt silicon PIN diode embedded in a glass substrate with dual 75 x 150 micron bond pads located near the chip edges.

The large pads allow use of multiple bond wires.

Features

  • Bond Pads Removed From Active Junction Large Bond Pads Support Multiple Bond Wires Rugged Silicon-Glass Construction Silicon Nitride Passivation Polyimide Scratch Protection Chip Layout.

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Datasheet preview – MA4BPS201

Datasheet Details

Part number MA4BPS201
Manufacturer Tyco
File Size 83.95 KB
Description PIN Diode Chips with Offset Bond Pads
Datasheet download datasheet MA4BPS201 Datasheet
Additional preview pages of the MA4BPS201 datasheet.

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Full PDF Text Transcription

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PIN Diode Chips With Offset Bond Pads MA4BPS101, MA4BPS201, MA4BPS301 MA4BPS101, MA4BPS201, MA4BPS301 PIN Diode Chips with Offset Bond Pads Features • • • • • Bond Pads Removed From Active Junction Large Bond Pads Support Multiple Bond Wires Rugged Silicon-Glass Construction Silicon Nitride Passivation Polyimide Scratch Protection Chip Layout Description These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process. They contain a single shunt silicon PIN diode embedded in a glass substrate with dual 75 x 150 micron bond pads located near the chip edges. The large pads allow use of multiple bond wires. The location of these pads on a glass substrate results in low parasitic capacitance.
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