Datasheet4U Logo Datasheet4U.com

MA4BPS301 Datasheet - Tyco

MA4BPS301 - PIN Diode Chips with Offset Bond Pads

These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process.

They contain a single shunt silicon PIN diode embedded in a glass substrate with dual 75 x 150 micron bond pads located near the chip edges.

The large pads allow use of multiple bond wires.

The location of th

MA4BPS301_TycoElectronics.pdf

Preview of MA4BPS301 PDF
MA4BPS301 Datasheet Preview Page 2 MA4BPS301 Datasheet Preview Page 3

Datasheet Details

Part number:

MA4BPS301

Manufacturer:

Tyco

File Size:

83.95 KB

Description:

Pin diode chips with offset bond pads.

📁 Related Datasheet

📌 All Tags