Datasheet4U Logo Datasheet4U.com

MA4BPS301 - PIN Diode Chips with Offset Bond Pads

MA4BPS301 Description

PIN Diode Chips With Offset Bond Pads MA4BPS101, MA4BPS201, MA4BPS301 MA4BPS101, MA4BPS201, MA4BPS301 PIN Diode Chips with Offset Bond Pads .
These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process.

MA4BPS301 Applications

* Absolute Maximum Rating Parameter Operating Temperature Storage Temperature Forward Current Reverse Voltage Incident RF Power Mounting Temperature 1 Applications These diodes are designed for use as general PIN elements in switches and switched pad attenuators. The chips can handle up to 10 watt

📥 Download Datasheet

Preview of MA4BPS301 PDF
datasheet Preview Page 2 datasheet Preview Page 3

Datasheet Details

Part number
MA4BPS301
Manufacturer
Tyco
File Size
83.95 KB
Datasheet
MA4BPS301_TycoElectronics.pdf
Description
PIN Diode Chips with Offset Bond Pads

📁 Related Datasheet

  • MA4BN1840-1 - Monolithic HMIC Integrated Network (Tyco Electronics)
  • MA4BN1840-2 - Monolithic HMIC Integrated Dual Bias Network (Tyco Electronics)
  • MA4000 - Silicon planar type (Panasonic)
  • MA4000N - Silicon planar type (Panasonic Semiconductor)
  • MA40016 - Ceramic Packaged Silicon Schottky Mixer Diodes (MA-COM)
  • MA40017 - Ceramic Packaged Silicon Schottky Mixer Diodes (MA-COM)
  • MA40018 - Ceramic Packaged Silicon Schottky Mixer Diodes (MA-COM)
  • MA40019 - Ceramic Packaged Silicon Schottky Mixer Diodes (MA-COM)

📌 All Tags

PIN Diode Chips with Offset Bond Pads Tyco
Tyco MA4BPS301-like datasheet

MA4BPS301 Stock/Price