Part number:
MA4BPS301
Manufacturer:
Tyco
File Size:
83.95 KB
Description:
Pin diode chips with offset bond pads.
Datasheet Details
These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process.
They contain a single shunt silicon PIN diode embedded in a glass substrate with dual 75 x 150 micron bond pads located near the chip edges.
The large pads allow use of multiple bond wires.
The location of th
Datasheet Details
MA4BPS301
Tyco
83.95 KB
Pin diode chips with offset bond pads.
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