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MA4BPS301 PIN Diode Chips with Offset Bond Pads

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Description

PIN Diode Chips With Offset Bond Pads MA4BPS101, MA4BPS201, MA4BPS301 MA4BPS101, MA4BPS201, MA4BPS301 PIN Diode Chips with Offset Bond Pads .
These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process.

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Datasheet Specifications

Part number
MA4BPS301
Manufacturer
Tyco
File Size
83.95 KB
Datasheet
MA4BPS301_TycoElectronics.pdf
Description
PIN Diode Chips with Offset Bond Pads

Applications

* Absolute Maximum Rating Parameter Operating Temperature Storage Temperature Forward Current Reverse Voltage Incident RF Power Mounting Temperature 1 Applications These diodes are designed for use as general PIN elements in switches and switched pad attenuators. The chips can handle up to 10 watt

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