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MA4BPS301

PIN Diode Chips with Offset Bond Pads

MA4BPS301 Features

* Bond Pads Removed From Active Junction Large Bond Pads Support Multiple Bond Wires Rugged Silicon-Glass Construction Silicon Nitride Passivation Polyimide Scratch Protection Chip Layout Description These silicon - glass PIN diode chips are fabricat

MA4BPS301 General Description

These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process. They contain a single shunt silicon PIN diode embedded in a glass substrate with dual 75 x 150 micron bond pads located near the chip edges. The large pads allow use of multiple bond wires. The location of th.

MA4BPS301 Datasheet (83.95 KB)

Preview of MA4BPS301 PDF

Datasheet Details

Part number:

MA4BPS301

Manufacturer:

Tyco

File Size:

83.95 KB

Description:

Pin diode chips with offset bond pads.

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MA4BPS301 PIN Diode Chips with Offset Bond Pads Tyco

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