MA4BPS301 Datasheet, Pads, Tyco

MA4BPS301 Features

• Pads
• Bond Pads Removed From Active Junction Large Bond Pads Support Multiple Bond Wires Rugged Silicon-Glass Construction Silicon Nitride Pa

PDF File Details

Part number:

MA4BPS301

Manufacturer:

Tyco

File Size:

83.95kb

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📄 Datasheet

Description:

Pin diode chips with offset bond pads. These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process. They contain a single shunt silicon PIN d

MA4BPS301 Application

• Applications Absolute Maximum Rating Parameter Operating Temperature Storage Temperature Forward Current Reverse Voltage Incident RF Power Mountin

TAGS

MA4BPS301

Tyco

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