MA4BPS201 Datasheet, Pads, Tyco

MA4BPS201 Features

  • Pads
  • Bond Pads Removed From Active Junction Large Bond Pads Support Multiple Bond Wires Rugged Silicon-Glass Construction Silicon Nitride Pa

PDF File Details

Part number:

MA4BPS201

Manufacturer:

Tyco

File Size:

83.95kb

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📄 Datasheet

Description:

Pin diode chips with offset bond pads. These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process. They contain a single shunt silicon PIN d

Datasheet Preview: MA4BPS201 📥 Download PDF (83.95kb)
Page 2 of MA4BPS201 Page 3 of MA4BPS201

MA4BPS201 Application

  • Applications Absolute Maximum Rating Parameter Operating Temperature Storage Temperature Forward Current Reverse Voltage Incident RF Power Mountin

TAGS

MA4BPS201
PIN
Diode
Chips
with
Offset
Bond
Pads
Tyco

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