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MA4BPS201 Datasheet - Tyco

MA4BPS201 PIN Diode Chips with Offset Bond Pads

These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process. They contain a single shunt silicon PIN diode embedded in a glass substrate with dual 75 x 150 micron bond pads located near the chip edges. The large pads allow use of multiple bond wires. The location of th.

MA4BPS201_TycoElectronics.pdf

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Datasheet Details

Part number:

MA4BPS201

Manufacturer:

Tyco

File Size:

83.95 KB

Description:

Pin diode chips with offset bond pads.

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MA4BPS201 MA4BPS201 PIN Diode Chips with Offset Bond Pads Tyco

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