MA4BPS101 - PIN Diode Chips with Offset Bond Pads

Tyco

Datasheet Details

These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process.

Bond Pads Removed From Active Junction Large Bond Pads Support Multiple Bond Wires Rugged Silicon-Glass Construction Silicon Nitride Passivation Polyimide Scratch Protection Chip Layout.

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Tyco MA4BPS101-like datasheet

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