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MA4FCP300 - Silicon Flip Chip PIN Diode

General Description

M/A-COM’s MA4FCP Series consists of Silicon Flip Chip PIN diodes fabricated with M/A-COM’s patented HMIC process.

This diode is fabricated on epitaxial wafers using a process designed for repeatable electrical characteristics and extremely low parasitics.

Key Features

  • n n n n n n n Low Series Resistance : 2.6 Ω Low Capacitance : 45 fF Fast Switching Speed : 40 nS Silicon Nitride Passivation Polyimide Scratch Protection Designed for Automated Pick and Place Insertion Rugged by Design Top View A B F.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Silicon Flip Chip PIN Diode V 1.00 MA4FCP300 1269 Outline Drawing Features n n n n n n n Low Series Resistance : 2.6 Ω Low Capacitance : 45 fF Fast Switching Speed : 40 nS Silicon Nitride Passivation Polyimide Scratch Protection Designed for Automated Pick and Place Insertion Rugged by Design Top View A B F Description M/A-COM’s MA4FCP Series consists of Silicon Flip Chip PIN diodes fabricated with M/A-COM’s patented HMIC process. This diode is fabricated on epitaxial wafers using a process designed for repeatable electrical characteristics and extremely low parasitics. This diode is fully passivated with Silicon Nitride and has an additional layer of Polyimide for scratch protection. These protective coatings prevent damage to the junction during automated or manual handling.