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MADP-042005 Datasheet SURMOUNT TM 5 um PIN Diodes

Manufacturer: Tyco Electronics (now TE Connectivity)

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General Description

and Applications This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM’s patented HMICTM process.

This device

Overview

www.DataSheet4U.com SURMOUNT TM 5 µm PIN Diodes—MADP-042305-130600, MADP-042405-130600, MADP-042505-130600,.

Key Features

  • Surface Mount, 5 µm I-Region Length Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance Higher Average and Peak Power Handling MADP-042005 Series V2 Absolute Maximum Ratings1 @ TA = +25 °C (unless otherwise specified) Parameter Part Forward Current Reverse Voltage Operating Temperature Storage Temperature Junction Tempe.

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