MADP-042005 diodes equivalent, surmount tm 5 um pin diodes.
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* Surface Mount, 5 µm I-Region Length Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation P.
This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM’s patented HMICTM process. This device features tw.
and Applications
This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM’s patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal .
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