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MADP-064908-131000 - Surface Mount Monolithic Integrated PIN Diode

General Description

This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM’s patented HMIC process.

Key Features

  • No Wirebonds Required.
  • Rugged Silicon-Glass Construction.
  • Silicon Nitride Passivation & Polymer Scratch Protection.
  • Ultra-Low Parasitic Capacitance and Inductance.
  • Higher RF C. W. Power Handling.
  • Better Performance than Alternative Packaged Devices MADP-064908-131000 Surmount TM PIN Chip V1 Absolute Maximum Ratings1 @ T A = +25 °C (unless otherwise specified) Parameter Forward Current Reverse Voltage Operating Temperature Storage Temperatur.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.DataSheet4U.com Surface Mount Monolithic Integrated PIN Diode Chip: 0604 Unconnected Double Tee Features • No Wirebonds Required • Rugged Silicon-Glass Construction • Silicon Nitride Passivation & Polymer Scratch Protection • Ultra-Low Parasitic Capacitance and Inductance • Higher RF C.W. Power Handling • Better Performance than Alternative Packaged Devices MADP-064908-131000 Surmount TM PIN Chip V1 Absolute Maximum Ratings1 @ T A = +25 °C (unless otherwise specified) Parameter Forward Current Reverse Voltage Operating Temperature Storage Temperature Absolute Maximum 250 mA l –100 V l -55 °C to +125 °C -55 °C to +150 °C +175 °C +35 dBm +300 °C for 10 seconds Description and Applications This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM’s patented HMIC process.