Description
This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM’s patented HMIC process.
Features
- No Wirebonds Required.
- Rugged Silicon-Glass Construction.
- Silicon Nitride Passivation & Polymer Scratch Protection.
- Ultra-Low Parasitic Capacitance and Inductance.
- Higher RF C. W. Power Handling.
- Better Performance than Alternative Packaged Devices
MADP-064908-131000 Surmount TM PIN Chip V1
Absolute Maximum Ratings1 @ T A = +25 °C (unless otherwise specified)
Parameter Forward Current Reverse Voltage Operating Temperature Storage Temperatur.
MADP-064908-131000 Datasheet
