Datasheet4U Logo Datasheet4U.com

MADP-042005 - SURMOUNT TM 5 um PIN Diodes

General Description

This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM’s patented HMICTM process.

Key Features

  • Surface Mount, 5 µm I-Region Length Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance Higher Average and Peak Power Handling MADP-042005 Series V2 Absolute Maximum Ratings1 @ TA = +25 °C (unless otherwise specified) Parameter Part Forward Current Reverse Voltage Operating Temperature Storage Temperature Junction Tempe.

📥 Download Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.DataSheet4U.com SURMOUNT TM 5 µm PIN Diodes—MADP-042305-130600, MADP-042405-130600, MADP-042505-130600, MADP-042905-130600 Features • • • • • • • Surface Mount, 5 µm I-Region Length Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance Higher Average and Peak Power Handling MADP-042005 Series V2 Absolute Maximum Ratings1 @ TA = +25 °C (unless otherwise specified) Parameter Part Forward Current Reverse Voltage Operating Temperature Storage Temperature Junction Temperature C.W.