Description
This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM’s patented HMICTM process.
Features
- Surface Mount, 5 µm I-Region Length Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance Higher Average and Peak Power Handling
MADP-042005 Series V2
Absolute Maximum Ratings1 @ TA = +25 °C (unless otherwise specified)
Parameter Part Forward Current Reverse Voltage Operating Temperature Storage Temperature Junction Tempe.
MADP-042005 Datasheet
