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MADP-064908-131000 Datasheet Surface Mount Monolithic Integrated PIN Diode

Manufacturer: Tyco Electronics (now TE Connectivity)

General Description

and Applications This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM’s patented HMIC process.

This 8.0 µm I-region length device

Overview

www.DataSheet4U.com Surface Mount Monolithic Integrated PIN Diode Chip: 0604 Unconnected Double.

Key Features

  • No Wirebonds Required.
  • Rugged Silicon-Glass Construction.
  • Silicon Nitride Passivation & Polymer Scratch Protection.
  • Ultra-Low Parasitic Capacitance and Inductance.
  • Higher RF C. W. Power Handling.
  • Better Performance than Alternative Packaged Devices MADP-064908-131000 Surmount TM PIN Chip V1 Absolute Maximum Ratings1 @ T A = +25 °C (unless otherwise specified) Parameter Forward Current Reverse Voltage Operating Temperature Storage Temperatur.