MADP-064908-131000 datasheet, diode equivalent, Tyco Electronics

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MADP-064908-131000 Features and benefits

* No Wirebonds Required
* Rugged Silicon-Glass Construction
* Silicon Nitride Passivation & Polymer Scratch Protection
* Ultra-Low Parasitic Capacitance a.

MADP-064908-131000 Application

This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM’s patented HMIC process. This 8.0 µm I-region leng.

MADP-064908-131000 Description

and Applications This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM’s patented HMIC process. This 8.0 µm I-region length device features 6 silicon pedestals embedded in a low loss, low dispersion glass. The diodes are formed on the.

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