MADP-064908-131000 Description
and Applications This device is a Silicon-Glass PIN diode chip fabricated with M/A-’s patented HMIC process. This 8.0 µm I-region length device.
MADP-064908-131000 Key Features
- No Wirebonds Required
- Rugged Silicon-Glass Construction
- Silicon Nitride Passivation & Polymer Scratch Protection
- Ultra-Low Parasitic Capacitance and Inductance
- Higher RF C.W. Power Handling
- Better Performance than Alternative Packaged Devices