THERMAL RESISTANCE RATINGS
Maximum Junction-to-Ambientb, f
Maximum Junction-to-Case (Drain)
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 125 °C/W.
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
VGS(th) Temperature Coefficient
Gate-Source Threshold Voltage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Total Gate Charge
Turn-On Delay Time
VGS = 0 V, ID = 250 µA
ID = 250 µA
VDS = VGS, ID = 250 µA
VDS = 0 V, VGS = ± 3 V
VDS = 0 V, VGS = ± 6 V
VDS = 20 V, VGS = 0 V
VDS = 20 V, VGS = 0 V, TJ = 55 °C
VDS ≥ 5 V, VGS = 4.5 V
VGS = 4.5 V, ID = 1.6 A
VGS = 2.5 V, ID = 1.5 Ahttp://www.DataSheet4U.net/
VGS = 1.8 V, ID = 1.3 A
VGS = 1.5 V, ID = 0.3 A
VDS = 10 V, ID = 1.6 A
VDS = 10 V, VGS = 4.5 V, ID = 1.7 A
f = 1 MHz
VDD = 10 V, RL = 7.7 Ω
ID ≅ 1.3 A, VGEN = 4.5 V, Rg = 1 Ω
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
TC = 25 °C
IS = 1.3 A, VGS = 0 V
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Min. Typ. Max.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Document Number: 64808
S09-0667-Rev. A, 20-Apr-09
datasheet pdf - http://www.DataSheet4U.net/