SIB404DK Datasheet | Vishay

FEATURES - Halogen-free According to IEC 61249-2-21 Definition - Trench FET® Power MOSFET - New Thermally Enhanced Power PAK® SC-75 Package - Small Footprint Area - Low On-Resistance - Thin 0.75 mm Profile - 100 % Rg Tested - pliant to Ro HS Directive 2002/95/EC Power PAK SC-75-6L-Single 1 D 2 D 3 6 D 5 D S 4 S 1.60 mm G APPLICATIONS - Portable Devices - Low Voltage Gate Drive Load Switch Marking Code AIX Part # code XXX Lot Traceability and Date code Ordering Information: Si B404DK-T1-GE3 (Lead (Pb)-free and Halogen-free) S N-Channel MOSFET G 1.60 mm ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) Parameter Drain-Source Voltage Gate-Source Voltage TC = 25 °C Continuous Drain Current (TJ = 150 °C) TC = 70 °C TA = 25 °C TA = 70 °C Pulsed Drain Current Continuous Source-Drain Diode Current TC = 25 °C TA = 25 °C TC = 25 °C Maximum Power Dissipation TC = 70 °C TA = 25 °C TA = 70 °C Operating Junction and Storage Temperature Range Soldering Remendations (Peak Temperature)d, e TJ, Tstg PD IDM IS ID Symbol VDS http://..net/ Limit 12 ±5 9a 9a 8.9b, c 7.1b, c 35 9a 2.1b, c 13 8.4 2.5b, c 1.6b, c - 55 to 150 260 Unit V °C THERMAL RESISTANCE RATINGS Parameter Maximum Junction-to-Ambient Maximum Junction-to-Case (Drain) b, f t5s Steady State Symbol Rth JA Rth JC Typical 41 7.5 Maximum 51 9.5 Unit °C/W Notes: a. Package limited, TC = 25 °C. b. Surface mounted on 1" x 1" FR4 board. c. t = 5 s. d. See solder profile (.vishay./ppg?73257). The Power PAK SC-75 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. e. Rework conditions: manual soldering with a soldering iron is not remended for leadless ponents. f. Maximum under steady state conditions is 105 °C/W. Document Number: 67099 S11-0236-Rev. A, 14-Feb-11 .vishay. 1...