SIB408DK Datasheet | Vishay

FEATURES - Halogen-free According to IEC 61249-2-21 Definition - Trench FET® Power MOSFET - New Thermally Enhanced Power PAK® SC-75 Package - Small Footprint Area - Low On-Resistance - 100 % Rg Tested - 100 % UIS Tested - pliant to Ro HS Directive 2002/95/EC Power PAK SC-75-6L-Single 1 D 2 D 3 6 D 5 D S 4 S 1.60 mm G Part # code APPLICATIONS Marking Code AEX XXX Lot Traceability and Date code Ordering Information: Si B408DK-T1-GE3 (Lead (Pb)-free and Halogen-free) S N-Channel MOSFET - Notebook - Load Switch 1.60 mm ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C TC = 25 °C TA = 25 °C L = 0.1 m H TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C http://..net/ Symbol VDS VGS ID Limit 30 ± 20 7a 7a 6b, c 4.8b, c 20 7a 2b, c 10 5 13 8.4 2.4b, c 1.6b, c - 55 to 150 260 Unit V Continuous Drain Current (TJ = 150 °C) Pulsed Drain Current Continuous Source-Drain Diode Current Avalanche Current Pulse Avalanche Energy IDM IS IAS EAS PD TJ, Tstg A m J Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Remendations (Peak Temperature)d, e °C THERMAL RESISTANCE RATINGS Symbol Typical Maximum Unit t≤5s Rth JA 41 51 Maximum Junction-to-Ambientb, f °C/W Rth JC Maximum Junction-to-Case (Drain) Steady State 7.5 9.5 Notes: a. Package limited. b. Surface Mounted on 1" x 1" FR4 board. c. t = 5 s. d. See Solder Profile (.vishay./ppg?73257). The Power PAK SC-75 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. e. Rework Conditions: manual soldering with a soldering iron is not remended for leadless ponents. f. Maximum under Steady State conditions is 105 °C/W. Document Number: 64828 S09-0859-Rev. A, 18-May-09 .vishay....