THJP0612 Datasheet | Vishay

.vishay. THJP Vishay Dale Thin Film Therma Wick® Thermal Jumper Surface Mount Chip LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models Product Page Infographics Videos Packages Footprints THJP surface-mount chips are designed to provide an electrically isolated thermal conductive pathway to a ground plane or heat sink while maintaining the electrical isolation of the device. The devices are constructed with aluminum nitride substrates in both Sn Pb and Pb-free wraparound termination styles. The low capacitance of the device makes them an excellent choice for high frequency and thermal ladder applications. Custom sizes available. CONSTRUCTION Solder coating Nickel termination Aluminum nitride substrate Features - Electrically isolated thermal conductor - High thermal conductivity Al N substrate (170 W/m K) - Electrically isolated terminations (> 999 MΩ) Available Available - Low capacitance - Available with Sn Pb or lead (Pb)-free wrap terminations Available - AEC-Q200 qualified - Material categorization: for definitions of pliance please see .vishay./doc?99912 APPLICATIONS - Power supplies and converters - RF...