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THJP0612 - Thermal Jumper Surface-Mount Chip

Download the THJP0612 datasheet PDF. This datasheet also covers the THJP0603 variant, as both devices belong to the same thermal jumper surface-mount chip family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Electrically isolated thermal conductor.
  • High thermal conductivity AlN substrate (170 W/mK).
  • Electrically isolated terminations (> 999 MΩ) Available Available.
  • Low capacitance.
  • Available with SnPb or lead (Pb)-free wrap terminations Available.
  • AEC-Q200 qualified.
  • Material categorization: for definitions of compliance please see www. vishay. com/doc?99912.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (THJP0603-Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number THJP0612
Manufacturer Vishay
File Size 163.75 KB
Description Thermal Jumper Surface-Mount Chip
Datasheet download datasheet THJP0612 Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer

Other Datasheets by Vishay

Part Number Description
THJP0603 Thermal Jumper Surface-Mount Chip
THJP0805 Thermal Jumper Surface-Mount Chip
THJP1206 Thermal Jumper Surface-Mount Chip
THJP1225 Thermal Jumper Surface-Mount Chip
THJP2512 Thermal Jumper Surface-Mount Chip

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.vishay.com THJP Vishay Dale Thin Film ThermaWick® Thermal Jumper Surface Mount Chip LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models Product Page Infographics Videos Packages Footprints THJP surface-mount chips are designed to provide an electrically isolated thermal conductive pathway to a ground plane or heat sink while maintaining the electrical isolation of the device. The devices are constructed with aluminum nitride substrates in both SnPb and Pb-free wraparound termination styles. The low capacitance of the device makes them an excellent choice for high frequency and thermal ladder applications. Custom sizes available.