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THJP0612 Datasheet Thermal Jumper Surface-mount Chip

Manufacturer: Vishay

Overview: www.vishay.com THJP Vishay Dale Thin Film ThermaWick® Thermal Jumper Surface Mount Chip LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models Product Page Infographics Videos Packages Footprints THJP surface-mount chips are designed to provide an electrically isolated thermal conductive pathway to a ground plane or heat sink while maintaining the electrical isolation of the device. The devices are constructed with aluminum nitride substrates in both SnPb and Pb-free wraparound termination styles. The low capacitance of the device makes them an excellent choice for high frequency and thermal ladder applications. Custom sizes available.

This datasheet includes multiple variants, all published together in a single manufacturer document.

Key Features

  • Electrically isolated thermal conductor.
  • High thermal conductivity AlN substrate (170 W/mK).
  • Electrically isolated terminations (> 999 MΩ) Available Available.
  • Low capacitance.
  • Available with SnPb or lead (Pb)-free wrap terminations Available.
  • AEC-Q200 qualified.
  • Material categorization: for definitions of compliance please see www. vishay. com/doc?99912.

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