THJP0612
FEATURES
- Electrically isolated thermal conductor
- High thermal conductivity Al N substrate (170 W/m K)
- Electrically isolated terminations (> 999 MΩ)
Available Available
- Low capacitance
- Available with Sn Pb or lead (Pb)-free wrap terminations
Available
- AEC-Q200 qualified
- Material categorization: for definitions of pliance please see .vishay./doc?99912
APPLICATIONS
- Power supplies and converters
- RF amplifiers
- Synthesizers
- Switch mode power supplies
- Pin and laser diodes
- Filters
FUNCTIONAL APPLICATIONS / CONNECTION OPTIONS
- ponent to heat sink
- ponent to case
- ponent to ground plane
- Pad to pad
- Pad to via
- Pad to trace
HEAT TRANSFER DEMONSTRATION Chip surface temperature was measured using a FLIR SC645 thermal imaging system under ambient conditions. The devices were mounted to an FR4 test card designed with a 25 mm x 19 mm copper heat sink. Power was supplied to device to cause the surface temperature to stabilize at 150 °C. The device was then...
