Datasheet Details
| Part number | FCSP0530ETR |
|---|---|
| Manufacturer | Vishay |
| File Size | 119.19 KB |
| Description | chip scale packaging to deliver Schottky diodes |
| Datasheet | FCSP0530ETR_VishaySiliconix.pdf |
|
|
Overview: FCSP0530ETR Vishay High Power Products FlipKY®, 0.5 A.
| Part number | FCSP0530ETR |
|---|---|
| Manufacturer | Vishay |
| File Size | 119.19 KB |
| Description | chip scale packaging to deliver Schottky diodes |
| Datasheet | FCSP0530ETR_VishaySiliconix.pdf |
|
|
|
FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in the industry.
The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space.
The anode and cathode connections are made through solder bump pads on one side of the silicon rather than through protruding leads enabling designers to strategically place the diodes on the PCB.
| Part Number | Description |
|---|---|
| FCSP0530TR | Chip Scale Package Schottky Barrier Rectifier |
| FCSP05H40ETR | chip scale packaging to deliver Schottky diodes |
| FCSP05H40TR | Chip Scale Package Schottky Barrier Rectifier |
| FCSP0730TR | Chip Scale Package Schottky Barrier Rectifier |
| FCSP07H40TR | Chip Scale Package Schottky Barrier Rectifier |
| FCSP130ETR | Chip Scale Package Schottky Barrier Rectifier |
| FCSP130LTR | Chip Scale Package Schottky Barrier Rectifier |
| FCSP130TR | Chip Scale Package Schottky Barrier Rectifier |
| FCSP140ETR | Chip Scale Package Schottky Barrier Rectifier |
| FCSP140LTR | Chip Scale Package Schottky Barrier Rectifier |