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FCSP07H40TR - Chip Scale Package Schottky Barrier Rectifier

General Description

Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry.

The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.75 A and occupy only 1.08 mm2 of board space.

Key Features

  • Ultra low VF to footprint area.
  • Very low profile (< 0.6 mm).
  • Low thermal resistance.
  • Supplied tested and on tape and reel RoHS.

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Datasheet Details

Part number FCSP07H40TR
Manufacturer Vishay
File Size 156.15 KB
Description Chip Scale Package Schottky Barrier Rectifier
Datasheet download datasheet FCSP07H40TR Datasheet

Full PDF Text Transcription (Reference)

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FCSP07H40TR Vishay High Power Products FlipKY® Chip Scale Package Schottky Barrier Rectifier, 0.75 A FEATURES • Ultra low VF to footprint area • Very low profile (< 0.6 mm) • Low thermal resistance • Supplied tested and on tape and reel RoHS COMPLIANT APPLICATIONS • Reverse polarity protection • Current steering • Freewheeling FlipKY® • Flyback • Oring DESCRIPTION Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.75 A and occupy only 1.08 mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon enabling designers to strategically place the diodes on the PCB.