W3H32M72E-XSBX Description
White Electronic Designs W3H32M72E-XSBX PRELIMINARY 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package.
W3H32M72E-XSBX Key Features
- 208 Plastic Ball Grid Array (PBGA), 18 x 20mm
- 1.0mm pitch Differential data strobe (DQS, DQS#) per byte .. Internal, pipelined, double data rate architecture 4-bit pr
- 1- tCK mercial, Industrial and Military Temperature Ranges Organized as 32M x 72 Weight: W3H32M72E-XSBX
- 2.5 grams typical
W3H32M72E-XSBX Applications
- This product is under development, is not qualified or characterized and is subject to change without notice