W3H64M72E-XSBX Description
White Electronic Designs W3H64M72E-XSBX ADVANCED .. 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package.
W3H64M72E-XSBX Key Features
- 208 Plastic Ball Grid Array (PBGA), 17 x 23mm
- (SSTL_18 patible) Differential data strobe (DQS, DQS#) per byte Internal, pipelined, double data rate architecture 4-bit
- output drive strength Programmable CAS latency: 3, 4 or 5 Posted CAS additive latency: 0, 1, 2, 3 or 4 Write latency = R
- 1- tCK mercial, Industrial and Military Temperature Ranges Organized as 64M x 72 Weight: W3H64M72E-XSBX
- 2.5 grams typical
W3H64M72E-XSBX Applications
- This product is under development, is not qualified or characterized and is subject to change or cancellation without notice