W3H32M64E-XSBX Overview
White Electronic Designs W3H32M64E-XSBX ADVANCED .. 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package.
W3H32M64E-XSBX Key Features
- 208 Plastic Ball Grid Array (PBGA), 16 x 20mm
- output drive strength Programmable CAS latency: 3, 4 or 5 Posted CAS additive latency: 0, 1, 2, 3 or 4
- This product is under development, is not qualified or characterized and is subject to change or cancellation without not
- 2.5 grams typical