W3H32M64E-XSBX - 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package

Features

Data rate = 667.
, 533, 400 Package:.
208 Plastic Ball Grid Array (PBGA), 16 x 20mm.
1.0mm pitch DDR2 Data Rate = 667.
, 533, 400 Supply Voltage = 1.8V ± 0.1V Differential data strobe (DQS, DQS#) per byte Internal, pipelined, double data rate architecture 4-bit prefetch architecture DLL for alignment of DQ and DQS transitions with clock signal Four internal banks for concurrent operation (Per DDR2 SDRAM Die) Programmable Burst lengths: 4 or 8 Auto Refresh and Self Refresh.

White Electronic Designs

Datasheet Details

Part number	W3H32M64E-XSBX
Manufacturer	White Electronic Designs
File Size	254.37 KB
Description	32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
Datasheet	W3H32M64E-XSBX Datasheet
Additional preview pages of the W3H32M64E-XSBX datasheet.

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White Electronic Designs W3H32M64E-XSBX ADVANCED* www.DataSheet4U.com 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Package: • 208 Plastic Ball Grid Array (PBGA), 16 x 20mm • 1.0mm pitch DDR2 Data Rate = 667*, 533, 400 Supply Voltage = 1.8V ± 0.

Published: Apr 30, 2010 |