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WED3C7410E16M-400BX Datasheet Preview

WED3C7410E16M-400BX Datasheet

RISC Microprocessor Multichip Package

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Whitewww.datasheet4u.com Electronic Designs WED3C7410E16M-400BX
RISC Microprocessor Multichip Package *PRELIMINARY
OVERVIEW
The WED3C7410E16M-400BX is offered in Commercial (0°C
The WEDC 7410E/SSRAM multichip package is targeted for
high performance, space sensitive, low power systems and
supports the following power management features: doze,
nap, sleep and dynamic power management.
to +70°C), industrial (-40°C to +85°C) and military (-55°C
to +125°C) temperature ranges and is well suited for em-
bedded applications such as missiles, aerospace, flight
computers, fire control systems and rugged critical systems.
The WED3C7410E16M-400BX multichip package consists
of:
*This data sheet describes a product that is developmental, is not qualified or
characterized and is subject to change without notice.
• 7410E AltiVecRISC processor
• Dedicated 2MB SSRAM L2 cache, configured as
256Kx72
FEATURES
n Footprint compatible with WED3C7558M-XBX and
• 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)
• Maximum Core frequency = 400MHz @ 1.8V
• Maximum L2 Cache frequency = 200MHz
WED3C750A8M-200BX
n Implementation of Altivectechnology instruction set
n Optional, high-bandwidth MPX bus interface
• Maximum 60x Bus frequency = 100MHz
FIG. 1 MULTI-CHIP PACKAGE DIAGRAM
AltiVecis a trademark of Motorola Inc.
October 2002 Rev. 5
1 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com




White Electronic Designs

WED3C7410E16M-400BX Datasheet Preview

WED3C7410E16M-400BX Datasheet

RISC Microprocessor Multichip Package

No Preview Available !

Whitewww.datasheet4u.com Electronic Designs WED3C7410E16M-400BX
FIG. 2 BLOCK DIAGRAM
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520
2


Part Number WED3C7410E16M-400BX
Description RISC Microprocessor Multichip Package
Maker White Electronic Designs
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