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WED3C7410E16M-XBHX - 7410E RISC Microprocessor

Key Features

  • doze, nap, sleep and dynamic power management. The WED3C7410E16M-XBHX multichip package consists of: 7410E AltiVec™ RISC processor Dedicated 2MB SSRAM L2 cache, configured as 256Kx72 21mmx25mm, 255 HiTCE™ Ball Grid Array (CBGA) Core frequency = 450 or 400MHz @ 1.8V Maximum L2 Cache frequency = 200MHz Maximum 60x Bus frequency = 100MHz.
  • This product is under development, is not qualified or characterized and is subject to change without notice. The WED3C7410E16M-XBHX is offered in Commercial.

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Datasheet Details

Part number WED3C7410E16M-XBHX
Manufacturer White Electronic Designs
File Size 498.96 KB
Description 7410E RISC Microprocessor
Datasheet download datasheet WED3C7410E16M-XBHX Datasheet

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Full PDF Text Transcription (Reference)

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www.datasheet4u.com White Electronic Designs WED3C7410E16M-XBHX PRELIMINARY* 7410E RISC Microprocessor HiTCE™ Multichip Package OVERVIEW The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management. The WED3C7410E16M-XBHX multichip package consists of: 7410E AltiVec™ RISC processor Dedicated 2MB SSRAM L2 cache, configured as 256Kx72 21mmx25mm, 255 HiTCE™ Ball Grid Array (CBGA) Core frequency = 450 or 400MHz @ 1.8V Maximum L2 Cache frequency = 200MHz Maximum 60x Bus frequency = 100MHz * This product is under development, is not qualified or characterized and is subject to change without notice.