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WED3C7410E16M-400BX - RISC Microprocessor

Key Features

  • doze, nap, sleep and dynamic power management. The WED3C7410E16M-400BX multichip package consists of:.
  • 7410E AltiVec RISC processor.
  • Dedicated 2MB SSRAM L2 cache, configured as 256Kx72.
  • 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA).
  • Maximum Core frequency = 400MHz @ 1.8V.
  • Maximum L2 Cache frequency = 200MHz.
  • Maximum 60x Bus frequency = 100MHz.

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Datasheet Details

Part number WED3C7410E16M-400BX
Manufacturer White Electronic Designs
File Size 301.60 KB
Description RISC Microprocessor
Datasheet download datasheet WED3C7410E16M-400BX Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.datasheet4u.com White Electronic Designs WED3C7410E16M-400BX The WED3C7410E16M-400BX is offered in Commercial (0°C to +70°C), industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight computers, fire control systems and rugged critical systems. *This data sheet describes a product that is developmental, is not qualified or characterized and is subject to change without notice. RISC Microprocessor Multichip Package *PRELIMINARY OVERVIEW The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.