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HC165MEP - 8-Bit Parallel-Load Shift Registers

Download the HC165MEP datasheet PDF. This datasheet also covers the HC165EP variant, as both devices belong to the same 8-bit parallel-load shift registers family and are provided as variant models within a single manufacturer datasheet.

General Description

The SN74HC165 is an 8-bit parallel-load shift register that, when clocked, shifts the data toward a serial (QH) output.

H) inputs that are enabled by a low level at the shift/load (SH/LD) inp

Key Features

  • a clock-inhibit (CLK INH) function and a complementary serial (QH) output. Clocking is accomplished by a low-to-high transition of the clock (CLK) input while SH/LD is held high and CLK INH is held low. The functions of CLK and CLK INH are interchangeable. Since a low CLK and a low-to-high transition of CLK INH also accomplish clocking, CLK INH should be changed to the high level only while CLK is high. Parallel loading is inhibited when SH/LD is held high. While SH/LD is low, the parallel input.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (HC165EP-etcTI.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
SN74HC165ĆEP 8ĆBIT PARALLELĆLOAD SHIFT REGISTER D Controlled Baseline − One Assembly/Test Site, One Fabrication Site D Extended Temperature Performance of Up To −55°C to 125°C D Enhanced Diminishing Manufacturing Sources (DMS) Support D Enhanced Product-Change Notification D Qualification Pedigree† D 2-V to 6-V VCC Operation D Outputs Can Drive Up To 10 LSTTL Loads D Low Power Consumption, 80-µA Max ICC D Typical tpd = 13 ns † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life.