BC52PAS
Description
BC51PAS series BC52PAS series BC53PAS series DFN2020D-3 plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 2 0.65 mm.
Key Features
- High collector current capability
- Three current gain selections IC and ICM
- Reduced Printed-Circuit Board (PCB)
- Leadless very small SMD plastic area requirements package with medium power capability
- Exposed heat sink for excellent thermal
- Suitable for Automatic Optical and electrical conductivity Inspection (AOI) of solder joint
- AEC-Q101 qualified 1.3 Applications
- Linear voltage regulators
- Battery driven devices
- MOSFET drivers
