A82DL1622T (A82DL16x2T) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM

AMIC Technology

Description

A82DL16x2T(U) Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simulta.
The A82DL16x2T(U) family consists of 16 megabit, 3.

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Datasheet Specifications

Part number: A82DL1622T
Manufacturer: AMIC Technology
File Size: 963.20 KB
Datasheet: A82DL1622T_AMICTechnology.pdf
Description: (A82DL16x2T) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM

Features

* Single power supply operation 2.7 to 3.6 volt High Performance - Access time as fast as 70ns Package 69-Ball TFBGA (8x11x1.4 mm) Industrial operating temperature range: -40°C to 85°C for
* U; -25°C to 85°C for
* I - Suspends erase operations to allow programming in same bank Data Polli

Applications

* Three devices are available with these bank sizes: Device DL1622 DL1632 DL1642 Bank 1 2 Mb 4 Mb 8 Mb Bank 2 14 Mb 12 Mb 8 Mb PRELIMINARY (May, 2005, Version 0.1) 2 AMIC Technology, Corp. A82DL16x2T(U) Series Pin Configurations 69-Ball TFBGA Top View Flash only A1 A5 A6 A10 NC B1 B3 B4 NC B5

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A82DL1622T A82DL16x2T Stacked Multi-Chip Package MCP Flash Memory and SRAM AMIC Technology

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