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HSMX-H670

Surface Mount Flip Chip LEDs

HSMX-H670 Features

* Improved Reliability Through Elimination of Internal Wire Bond

* -40 to 85°C Operating Temperature Range

* Small Size

* Industry Standard Footprint

* Diffused Optics

* Compatible with IR Solder Process

* Four Colors Available

* Availa

HSMX-H670 General Description

The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product reliability is greatly improved. The HSMX-H670 and.

HSMX-H670 Datasheet (242.04 KB)

Preview of HSMX-H670 PDF

Datasheet Details

Part number:

HSMX-H670

Manufacturer:

Agilent(Hewlett-Packard)

File Size:

242.04 KB

Description:

Surface mount flip chip leds.

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TAGS

HSMX-H670 Surface Mount Flip Chip LEDs Agilent(Hewlett-Packard)

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