HSMX-H690, HSMX-H690_Agilent(Hewlett Datasheet (Agilent(Hewlett-Packard))

HSMX-H690 - Surface Mount Flip Chip LEDs

The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs.

The internal flip chip construction eliminates the wire bond between the chip and printed circuit board.

Consequently as a result of the robust construction, product reliability is greatly improved.

The HSMX-H670 and

HSMX-H690 Features

* Improved Reliability Through Elimination of Internal Wire Bond

* -40 to 85°C Operating Temperature Range

* Small Size

* Industry Standard Footprint

* Diffused Optics

* Compatible with IR Solder Process

* Four Colors Available

* Availa