C470UT190 Datasheet - CREE

C470UT190 LED

P-N Junction Area (μm) Chip Top Area (μm) Chip Bottom Area (μm) Chip Thickness (μm) Au Bond Pad Diameter (μm) Bonding Area Note 5 Diameter (μm) Au Bond Pad Thickness (μm) Backside Contact Metal Area (μm) CxxxUT190-Sxxxx-31 Dimension Tolerance 160 x 160 ± 25 190 x 190 ± 25 150 x 150 ± 25 50.

Cree® UltraThin® UT190™ Gen 3 LEDs CxxxUT190-Sxxxx-31 Data Sheet (50 µm chip thickness) Cree’s UT190 LEDs combine highly efficient InGaN materials with Cree’s proprietary G SiC® substrate to deliver superior price/performance for blue LEDs. These vertically structured LED chips are small and thin with low forward voltage. Cree’s UT™ series chips are 100% tested for conformity to optical and electrical specifications, as well as the ability to withstand a 2000 V ESD pulse. Applicati.

C470UT190 Features

* Wavelengths for Blue, Green and White-conversion

* 50 mm Chip Thickness

* RF Performance:

* 450 nm

* 12+ mW

* 460 nm

* 10+ mW

* 470 nm

* 10+ mW

* 527 nm

* 4+ mW

* Low Forward Voltage

* 2.9

C470UT190-CREE.pdf

C470UT190 Datasheet Preview — Preview of C470UT190 PDF

Datasheet Details

Part number:

C470UT190

Manufacturer:

CREE

File Size:

390.26 KB

Description:

Led.

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