C470UT170 Datasheet - CREE

C470UT170 LED

P-N Junction Area (μm) Chip Top Area (μm) Chip Thickness (μm) Chip Bottom Area (μm) Au Bond Pad Diameter (μm) Bonding Area Diameter (μm) Note 5 Au Bond Pad Thickness (μm) Backside Contact Metal Area (μm) CxxxUT170-Sxxxx-31 Dimension Tolerance 140 x 140 ± 25 170 x 170 ± 25 50 ± 10 130 x 130.

Cree® UltraThin® Gen 3 LEDs Data Sheet CxxxUT170-Sxxxx-31 Cree’s UltraThin® LEDs combine highly efficient InGaN materials with Cree’s proprietary G SiC® substrate to deliver superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical specifications, as well as the ability to withstand 2000 V ESD. Applications include consumer products, mo.

C470UT170 Features

* Small Chip

* 170 x 170 x 50 μm

* Single Wire Bond Structure

* UT LED Performance

* 450 nm

* 12+ mW

* 460 nm

* 10+ mW

* 470 nm

* 10+ mW

* 527 nm

* 4+ mW

* Low Forward Voltage

* 2.9 V Ty

C470UT170-CREE.pdf

C470UT170 Datasheet Preview — Preview of C470UT170 PDF

Datasheet Details

Part number:

C470UT170

Manufacturer:

CREE

File Size:

263.03 KB

Description:

Led.

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