Part number:
741X163
Manufacturer:
CTS
File Size:
202.23 KB
Description:
(741xxxxx) thick film chip resistors arrays.
* Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits Concave and Convex Options RoHS C
741X163
CTS
202.23 KB
(741xxxxx) thick film chip resistors arrays.
📁 Related Datasheet
741X043 - (741Xxxxx) THICK FILM CHIP RESISTORS ARRAYS
(CTS)
Chip Resistor Arrays
Technical Data
Features
• • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construct.
741X083 - (741Xxxxx) THICK FILM CHIP RESISTORS ARRAYS
(CTS)
Chip Resistor Arrays
Technical Data
Features
• • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construct.
7410 - Triple 3 Input NAND Gates
(National Semiconductor)
5410 DM5410 DM7410 Triple 3-Input NAND Gates
June 1989
5410 DM5410 DM7410 Triple 3-Input NAND Gates
General Description
This device contains three .
7410 - Triple 3-input NAND gate
(Philips)
INTEGRATED CIRCUITS
DATA SHEET
For a plete data sheet, please also download:
• The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications • The IC06 7.
74107 - DUAL J-K FLIP-FLOP
(STMicroelectronics)
M54HC107 M74HC107
DUAL J-K FLIP FLOP WITH CLEAR
. . . . . . . .
HIGH SPEED fMAX = 75 MHz (TYP.) AT VCC = 5 V LOW POWER DISSIPATION ICC = 2 µA (MAX.).
74109 - Dual J-K Positive-Edge-Triggered Flip-Flops
(Texas Instruments)
.ti.
PACKAGE OPTION ADDENDUM
4-Dec-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package Eco Plan
(1)
Drawi.
7411 - Triple 3 Input AND Gate
(Fairchild Semiconductor)
.
7411 - TRIPLE 3-INPUT AND
(ETC)
Vcc
14
13
12
11
10
9
8
1
2
3
4
5
6
7
GND
7411: TRIPLE 3-INPUT AND
.
