Datasheet Details
Part number:
CP576
Manufacturer:
File Size:
186.45 KB
Description:
PNP Amp / Switch Transistor Chip
Power Transistor PROCESS CP576 Central TM PNP - Amp/Switch Transistor Chip Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 240 PRINCIPAL DEVICE TY
CP576_CentralSemiconductor.pdf
CP576, PNP Amp / Switch Transistor Chip
Power Transistor PROCESS CP576 Central TM PNP - Amp/Switch Transistor Chip Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 240 PRINCIPAL DEVICE TYPES MJ15004 MULTI EPITAXIAL PLANAR 203 x 227 MILS 12.5 ± 1.0 MILS 38 x 76 MILS 47 x 72 MILS Al - 50,000Å Ag - 10,000Å BACKSIDE COLLECTOR 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110
CP576 Distributor
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