Datasheet4U Logo Datasheet4U.com

CP611 Datasheet - Central Semiconductor

CP611 PNP Transistor

PROCESS Power Transistor CP611 PNP - Amp/Switch Transistor Chip www.DataSheet4U.com PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 1,300 PRINCIPAL DEVICE TYPES CJD42C TIP42C EPITAXIAL PLANAR 80 x 99 MILS 12.5 ± 1 MILS 12 x 32 MILS 13 x 46 MILS Al - 30,000Å Ag - 16,000Å BACKSIDE COLLECTOR R5 (22-March 2010) w w w. c e n t r a l s e m i . c o m PROCESS CP611 Typ.

CP611_CentralSemiconductor.pdf

Preview of CP611 PDF
CP611 Datasheet Preview Page 2

Datasheet Details

CP611 Distributor

📁 Related Datasheet

CP600 SINGLE-PHASE SILICON BRIDGE-P.C. MTG 3A / HEAT-SINK MTG 6A(VOLTAGE 50 to 1000 Volts CURRENT - P.C. MTG 3A / HEAT-SINK MTG 6A) (Pan Jit International Inc.)

CP600 SINGLE-PHASE SILICON BRIDGE-P.C. MTG 3A/ HEAR-SINK MTG 6A (TRSYS)

CP601 SINGLE-PHASE SILICON BRIDGE-P.C. MTG 3A / HEAT-SINK MTG 6A(VOLTAGE 50 to 1000 Volts CURRENT - P.C. MTG 3A / HEAT-SINK MTG 6A) (Pan Jit International Inc.)

CP601 SINGLE-PHASE SILICON BRIDGE-P.C. MTG 3A/ HEAR-SINK MTG 6A (TRSYS)

CP6010 SINGLE-PHASE SILICON BRIDGE-P.C. MTG 3A / HEAT-SINK MTG 6A(VOLTAGE 50 to 1000 Volts CURRENT - P.C. MTG 3A / HEAT-SINK MTG 6A) (Pan Jit International Inc.)

CP6015 HP Color LaserJet (HP)

CP6015DE HP Color LaserJet (HP)

CP6015DN HP Color LaserJet (HP)

TAGS

CP611 CP611 PNP Transistor Central Semiconductor