CP734V Datasheet (Central Semiconductor)

CP734V, NPN Transistor

www.DataSheet4U.com PROCESS CP734V Small Signal Transistors PNP - Chopper Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY EPITAXIAL PLANAR 31.5 x 31.5 MILS 7.0 MILS 4.7 x 6.7 MILS 4.7 x 8.7 MILS Al - 30,000Å Au - 18,000Å GROSS DIE PER 5 INCH WAFER 16,986 PRINCIPAL DEVICE TYPES CMPT404A MPS404A w w w.

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c o m R2 (22-March 2010) PROCESS CP734V Typical Elec