CP710 Datasheet - Central Semiconductor

CP710 PNP Transistor

www.DataSheet4U.com PROCESS Small Signal Transistor PNP - High Voltage Transistor Chip CP710 Central TM Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 16,880 PRINCIPAL DEVICE TYPES CMPTA94 CXTA94 CZTA94 MPSA94 EPITAXIAL PLANAR 26 x 26 MILS 9.0 MILS 6.1 x 4.9 MILS 5.2 x 5.2 MILS Al - 30,000Å Au - 18,000Å BACKSIDE COLLECTOR 145 Adams Avenue Ha.

CP710_CentralSemiconductor.pdf