CP716 Datasheet - Central Semiconductor

CP716 PNP Transistor

www.DataSheet4U.com PROCESS Small Signal Transistor PNP - High Voltage Transistor Chip CP716 Central TM Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 29,250 PRINCIPAL DEVICE TYPES CMPT5401 CXT5401 CZT5401 2N5401 EPITAXIAL PLANAR 20 x 20 MILS 9.0 MILS 4.0 x 4.0 MILS 4.7 x 4.7 MILS Al - 30,000Å Au - 18,000Å BACKSIDE COLLECTOR 145 Adams Avenue.

CP716_CentralSemiconductor.pdf