CP714 Datasheet - Central Semiconductor

CP714 PNP Transistor

www.DataSheet4U.com PROCESS Small Signal Transistor PNP - High Current Transistor Chip CP714 Central TM Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 7,070 PRINCIPAL DEVICE TYPES CBCP69 CBCX69 CZT751 MPS750 MPS751 EPITAXIAL PLANAR 40 x 40 MILS 9.0 MILS 7.9 x 8.7 MILS 9.0 x 14 MILS Al - 30,000Å Au - 18,000Å BACKSIDE COLLECTOR 145 Adams Avenu.

CP714_CentralSemiconductor.pdf